Objective
- Manufacturing of mircopatterns with structure heights up to 30 µm for applications
in the integrated optics
Methods
- Reduction of the shrinkage of the embossed structures by using organically modified
alkoxides and nanoscaled SiO2 particles
- Using flexible silicon stamper and low pressure during the embossing process
Results
- Adaptation of the material properties like refractive index, Young`s-modulus, thermal
expansion coefficient or mechanical and chemical resistance by variation of the used
coating material (SiO2 oder NanomerÓ )
- thermal or photo induced drying during the embossing process
- adjustable structure heights from 1 µm to 20 µm for both kinds of materials
(NanomerÓ or SiO2) after densification at
180 °C or 500 °C
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- low shrinkage during densification (10 - 25 % in height)
- embossed areas between 4 x 4 cm2 for SiO2 structures and
10 x 10 cm2 for NanomerÓ structures
Applications
- Creation of mircooptical areas by embossing at low pressure
- area: photovoltaic, reflection grating diffraction grating, moth eye structures, imaging
optics, optical waveguides
Benefits
- using low embossing pressure
- Preparation of SiO2 crackfree micropatterns with structure heights up to
20 µm
- Preparation of micropatterns on large area and uneven substrates using flexible silicon
stampers
- low shrinkage in heights during densification
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Laboratory Technology
