DESCRIPTION

Exceptional dielectric constants, volume resistivities, and dielectric strengths. Highly porous materials with unique nanostructures. 
Aerogels exhibit unusual dielectric properties more like those of a gas than of a solid. Their low dielectric constants, low loss tangents, and controllable thermal expansion properties will soon make aerogels the material of choice for thin films in high-speed, integrated digital and microwave circuitry.

Thin-film aerogel dielectric substrates

Thin aerogel films are excellent for electronic applications that require very low dielectric properties. We developed methods of fabricating aerogel films from 1 to 100 µm thick.
We are developing processes for sealing, patterning, and metalizing both bulk and thin-film aerogels. Qualitative tests show that aerogels can be used with conventional photoresist techniques. By varying chemical composition and density, we can tailor the aerogel's properties to the desired application. 
Aerogels also possess valuable complementary properties for electronics applications: they are lightweight with low thermal expansion and adequate thermal conductivity and mechanical strength.

STATUS : We are seeking industrial partners with whom we can develop commercial processes and prototype products.

CONTACT

Annemarie Meike,  Ph.D
Industrial Partnerships and Commercialization, L-795
P.O. Box 808
Lawrence Livermore National Laboratory
Livermore, CA 94551-0808
Phone: 925 422 3735
Fax: 925 423 8988
E-mail : meike1@llnl.gov

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