DESCRIPTION

Raw starting material with superior properties to conventional silicone resin by Sol-Gel. This patented material shows good crack resistance, solubility in various solvents, high transparency, thin film application, water repellency and high temperature resistance.

Product Application

Interlayer dielectric thin film in ULSI multiple wiring: Low K under 2.5 factor, heat resistance over 450 degrees Celsius (application in silicone chip production)

• Dielectric material for LCD displays 
• Hard coating for PDP, LCD and plastic automobile windows.
• Multifunctional, anti-fog and water repellent application for various materials.

Competition Advantages

• Feasible for productions at low costs
• No neutralizing and curing process in production
• Cost competitive and environmentally friendly
• Thermal superiority compared to other materials in market by above or below 50oC.
• Lower surface energy than common organic polymer.

Dielectric contact very low compared to competitive products even at high temperatures in an oxidative atmosphere.
Competitors include SILK from Dow Chemical and Dow Corning’s fox spin-on material
Applied Materials Inc. JSR in Japan, other organic polymer materials from various manufacturers. 



STATUS: Patent pending (W00160880)

CONTACT

Harrison Park
Intersilicone America
3335 Paraiso Way
Glendale CA 91214
USA

Phone: (818) 249-3340
Fax: (818) 249-3341
Email: harrisonkms@hotmail.com

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